Chen, Kuan-Neng, Ph.D.
Chair Professor
National Yang Ming Chiao Tung University (NYCU)
Come and visit Henkel at SEMICON TAIWAN 2024
AI's influence can be seen in nearly every technology sector. Whether it's the data center server structure, mobile device capability like photo enhancement, language translation, and interactivity, or exceptional efficiency on the factory floor, AI is the fuel of today's technology innovation. And consequently, its growth is projected to explode. According to market analysts, by 2027 nearly 45% (source: Canalys) of smartphones shipped will have AI on board, data center storage capacity is set to see an 18.5% CAGR (source: JLL) over the next five years.
AI is the focus of this year's SEMICON Taiwan event, and Henkel solutions are at the center of the conversation for AI-driven technology and beyond. Because at the foundation of all things AI and the technologies at the edge are sophisticated semiconductor packages and their dependability, efficient performance, and longevity depend on robust, reliable electronic materials. Whether your application demands superior encapsulant solutions for advanced packaging, high-reliability die attach film for challenging dimensions, die attach pastes with exceptional thermal control for high power density structures, or adhesives that secure automotive image sensing technology – Henkel has you covered.
Visit Henkel team in SEMICON Taiwan at our hospitality suite, engage with our technology experts, and
discover how Henkel innovation can help fuel your AI ambitions and beyond.
Make plans to attend our
expert sessions on each day of the show.
Seminar Agenda
14:00-15:00
DISCOVER WHY SEMICONDUCTOR PACKAGING LEADERS CHOOSE HENKEL.
Visit us and be enlightened by our insightful seminar and panel talk!
4th SEP
High Reliability Film
(Mandarin)
by Xinpei Cao from Henkel
5th SEP
Advanced Packaging
(English)
by Ram Trichur from Henkel,
Dr. Yik Yee Tan from Yole Group
6th SEP
Advanced Packaging
(Mandarin)
by Solomon Wu from Henkel,
Professor Chen from NYCU
Speakers
Yik Yee Tan, Ph.D.
Senior Technology & Market Analyst, Semiconductor Packaging
Yole Group
Ram Trichur
Global Market & Strategy Director
Henkel
Xinpei Cao
Senior Principal Application Engineer
Henkel
Solomon Wu
Technology Champion of Advanced Packaging
Henkel
Register now and let us know you're coming.
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